• DocumentCode
    3469733
  • Title

    A Robust Novel Technique for SPICE Simulation of ESD Snapback Characteristic

  • Author

    Jiao, Chao ; Yu, Zhiping

  • Author_Institution
    Inst. of Microelectron., Tsinghua Univ., Beijing
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1367
  • Lastpage
    1369
  • Abstract
    This paper presents a robust and novel technique for the circuit simulation of ESD (electrostatic discharge) snapback characteristic. A new linearization scheme for the avalanche current model in ESD evaluation shows a good convergence behavior during ESD stress simulation. This technique is compatible with the traditional circuit simulator based on the modified nodal analysis (MNA) like SPICE. We have implemented a simple ESD MOSFET model in SPICE3f5, and the simulation results are discussed
  • Keywords
    MOSFET; SPICE; circuit simulation; electrostatic discharge; linearisation techniques; ESD MOSFET model; ESD stress simulation; SPICE simulation; SPICE3f5; avalanche current model; circuit simulation; electrostatic discharge snapback characteristic; linearization scheme; modified nodal analysis; Circuit simulation; Convergence; Diodes; Electrostatic discharge; Feedback loop; MOSFET circuits; Resistors; Robustness; SPICE; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306185
  • Filename
    4098411