Title :
Improvement of chemical resistance of positive-tone photosensitive polyimide coatings in the electroless plating process
Author :
Baba, Osamu ; Kamemoto, Satoshi ; Masuda, Y. ; Yuba, T. ; Tomikawa, Morimasa
Author_Institution :
Electron. & Imaging Mater. Res. Labs, Toray Ind., Inc., Otsu, Japan
Abstract :
We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain chemical resistant for the electroless plating process. The obtained PSPI are useful for saving bumping process and reliable in forming pattern.
Keywords :
electroless deposited coatings; gold; nickel; polymers; semiconductor technology; Ni-Au; bumping process; chemical resistance; electroless plating process; forming pattern; polyimide polymer structure; positive-tone photosensitive polyimide coatings; Chemicals; Gold; Nickel; Polyimides; Resistance; Substrates; electroless plating process; good chemical resistance; polyimides;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756123