Nondestructive observation of fatigue crack propagation process in some solder joints by synchrotron radiation X-ray micro-tomography

Author

Tsuritani, Hiroyuki ; Sayama, Toshihiko ; Okamoto, Yuji ; Takayanagi, T. ; Uesugi, K. ; Mori, Takayoshi

Author_Institution

Machinery & Electron. Res. Inst., Toyama Ind. Technol. Center, Toyama, Japan

fYear

2013

fDate

11-13 Nov. 2013

Firstpage

1

Lastpage

4

Abstract

A synchrotron radiation X-ray micro-tomography system was applied to nondestructive visualization and evaluation of micro-crack propagation appearing as thermal fatigue damage in some solder joints. The fatigue crack propagation lifetime was accurately estimated on the basis of the three-dimensional crack images.

Keywords

ball grid arrays; computerised tomography; fatigue cracks; fracture mechanics; integrated circuit interconnections; integrated circuit packaging; microcracks; nondestructive testing; printed circuits; solders; PCBs; chip joint specimen; fatigue crack propagation lifetime; fine pitch ball grid array joint specimen; flip chip interconnect specimen; microcrack propagation; nondestructive evaluation; nondestructive visualization; solder joints; synchrotron radiation X-ray microtomography system; thermal fatigue damage; three-dimensional crack images; Computed tomography; Fatigue; Joints; Soldering; Synchrotron radiation; Three-dimensional displays; X-ray imaging; failure mechanics; material for packaging; reliability improvement;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd

Conference_Location

Kyoto

Print_ISBN

978-1-4799-2718-0

Type

conf

DOI

10.1109/ICSJ.2013.6756130

Filename

6756130