Title :
Automatic detection of spatial signature on wafermaps in a high volume production
Author :
Duvivier, Frédéric
Author_Institution :
Device & Yield Eng. Dept., STMicroelectron.-Central R&D, Croiles, France
Abstract :
In high volume production, it is important to have a fast response time to yield loss mechanisms. This paper presents a way to detect spatial yield loss on wafers. A procedure automatically computes and provides a summary of signatures taking into account all of the processed wafer. This reduces manual manipulation of data, providing a faster response time
Keywords :
data mining; electronic engineering computing; fault diagnosis; integrated circuit modelling; integrated circuit testing; integrated circuit yield; process monitoring; production engineering computing; production testing; automatic computation; automatic detection; fast response time; high volume production; process monitoring; random ratio; segmentation technique; spatial signature; spatial yield loss detection; wafermaps; wafers; yield loss mechanisms; Contamination; Delay; Displays; History; Manufacturing processes; Production; Research and development; Testing;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 1999. DFT '99. International Symposium on
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7695-0325-x
DOI :
10.1109/DFTVS.1999.802870
