• DocumentCode
    3472837
  • Title

    An Innovative Embedded Logic Analyzer Based SoC Verification Platform

  • Author

    Lu, Chao ; Chen, Zhaoqian ; Wang, Lingli ; Zhou, Xiaofang

  • Author_Institution
    Dept. of Microelectron., Fudan Univ., Shanghai
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    1876
  • Lastpage
    1879
  • Abstract
    This paper describes an innovative hardware/software co-verification platform, based on an embedded logic analyzer (ELA) in FPGA emulator, for system-on-a-chip. With the general-purpose ELA, the platform is rich in reusability, which reduces the expense of SOC verification. By offering the interface, image of design under test (DUT) and virtual channel, the platform plays the role as glue, which integrates different verification methods together. External verification tools as well as software develop environment can be involved in the platform. Behavior model written in C language and assertion-based verification (ABV) are also supported in this verification platform. To improve the verification efficiency, the platform can capture different amount of sampling signals dynamically in different situations using application-specific verification program. This platform characterizes high efficiency, flexibility and portability with low cost
  • Keywords
    C language; embedded systems; field programmable gate arrays; formal verification; hardware-software codesign; logic analysers; system-on-chip; C language; assertion-based verification; design under test; embedded logic analyzer; field programmable gate arrays; hardware/software co-verification; system-on-chip; virtual channel; Embedded software; Emulation; Field programmable gate arrays; Logic design; Logic testing; Performance analysis; Random access memory; Sampling methods; Software tools; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306494
  • Filename
    4098568