Trends in high density substrates for IC packages

The semiconductor industry is experiencing increased demand for high density substrates for IC packages. The main drivers are the high I/O counts and decreasing bump pitch for ASICs and microprocessors designed in flip chip layout. Applications ranging from personal computers to networking and high-end computers will increasingly use these high density substrates for their IC package solutions. Many of the applications have slightly different requirements and needs. Matching this demand with the available supply is critical. There is a long list of potential substrate suppliers with both laminate and tape-based solutions. Supplier capabilities in terms of feature sizes (line/space, via/pad) must match the needs of the customer. This paper addresses these critical issues by examining the user and supplier trends in high density substrate package needs by company and supplier status