• DocumentCode
    3475772
  • Title

    Ultra-Fast Negative Bias Temperature Instability Monitoring and End-of-Life Projection

  • Author

    Wang, Chi-Shiun ; Chang, Wen-Chun ; Ke, Wen-Shawn ; Su, Kuan-Cheng

  • Author_Institution
    Reliability Technol. & Assurance Div., United Microelectron. Corp.
  • fYear
    2006
  • fDate
    Oct. 16 2006-Sept. 19 2006
  • Firstpage
    136
  • Lastpage
    138
  • Abstract
    In this paper, we propose a comprehensive solution for in-line NBTI monitor, including test structure, bias condition determination, reliability specification calculation, and lifetime projection. A smart self-heating pMOSFET has been successfully realized in 90nm standard CMOS technology. For the first time, we use channel resistance to carefully calibrate device junction temperature. Charge separation technique can precisely define NBTI cold holes regimes. No interruption adopts during our NBTI monitor stress duration, which can avoid recovery effect. Finally, the end-of-life (EoL) projection of each device, which is consistent with time-consuming package result, can be achieved by applying acceleration models. The whole monitor process of each sample can be finished within 2 minutes. This novel monitor can provide an early alert of process control diagnosis
  • Keywords
    CMOS integrated circuits; MOSFET; semiconductor device reliability; thermal stability; 2 mins; 90 nm; CMOS technology; bias condition determination; channel resistance; charge separation technique; device junction temperature; end-of-life projection; inline NBTI monitor; lifetime projection; pMOSFET; process control diagnosis; reliability specification calculation; smart self-heating; test structure; ultrafast negative bias temperature instability monitoring; CMOS technology; Condition monitoring; Life testing; MOSFET circuits; Negative bias temperature instability; Niobium compounds; Stress; Temperature measurement; Temperature sensors; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2006 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    1-4244-0296-4
  • Electronic_ISBN
    1930-8841
  • Type

    conf

  • DOI
    10.1109/IRWS.2006.305228
  • Filename
    4098705