DocumentCode :
3476353
Title :
High speed test structures for in-line process of 3D system in packaging
Author :
Guanjiang Wang ; Zhiyuan Zhu ; Yichao Xu ; Runiu Fang ; Min Miao ; Yufeng Jin
Author_Institution :
Shenzhen Grad. Sch., Peking Univ., Shenzhen, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
11
Lastpage :
15
Abstract :
As the requirement of portable and smart devices rapidly increasing, applications of high performance 3D integration and M/NEMS packaging have enormous market potential. High speed in-line testing is a critical bottleneck for 3D SiP and TSV processes. In this paper, we promote a method of in-line testing for interconnection performance of TSV structures, and a novel 3D CPW model for performance testing is introduced. The S parameters and Z parameters are simulated respectively. To determine the optimum TSV diameter and sidewall thickness, different types of the model have been analyzed. During our experiments, a typical structure for high frequency performance testing was fabricated successfully. The results were compared with related simulations. By using this method, the high frequency performance testing of TSV can be achieved.
Keywords :
S-parameters; coplanar waveguides; integrated circuit testing; micromechanical devices; nanoelectromechanical devices; system-in-package; three-dimensional integrated circuits; 3D SiP processes; 3D system in packaging; CPW model; MEMS packaging; NEMS packaging; S parameters; TSV structures; Z parameters; high performance 3D integration; high speed test structures; inline process; interconnection performance; optimum TSV diameter; performance testing; portable devices; sidewall thickness; smart devices; Crosstalk; Integrated circuit modeling; SPICE; Solid modeling; Testing; Three-dimensional displays; Through-silicon vias; GSG; Through-Silicon-Via; high-frequency; in-line test; optimization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756410
Filename :
6756410
Link To Document :
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