• DocumentCode
    3476479
  • Title

    A novel package-on-package stacking technique

  • Author

    Xiaofeng Sun ; Maoyun Pan ; Yuan Lu ; Lixi Wan

  • Author_Institution
    Inst. of Microelectron., Beijing, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    34
  • Lastpage
    36
  • Abstract
    In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages.
  • Keywords
    ball grid arrays; fine-pitch technology; integrated circuit interconnections; integrated circuit packaging; solders; fine pitch solder ball; four-layer PoP stacking structure; four-layer package-on-package stacking structure; interconnection I-O density; neighboring packages; Cavity resonators; Electronics packaging; Fabrication; Heating; Packaging; Stacking; Substrates; 3D package; PoP; high density package; organic substrate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756415
  • Filename
    6756415
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3476479