Title :
Fault modeling of suspended thermal MEMS
Author :
Charlot, B. ; Mir, S. ; Cota, E.F. ; Lubaszewski, M. ; Courtois, B.
Author_Institution :
TIMA Lab., Grenoble, France
Abstract :
As next generation chips embedding MEMS appear, fault-based and defect-oriented tests for MEMS parts become important for cost-effective production testing. This paper presents realistic fault modeling and simulation techniques for suspended thermal MEMS, an already successful domain of application
Keywords :
equivalent circuits; fault simulation; finite element analysis; micromachining; micromechanical devices; production testing; semiconductor device models; semiconductor device testing; CMOS compatible bulk micromachining; FEM modelling; analog HDL; cost-effective production testing; defect-oriented tests; electrothermal convertor; equivalent electrical model; fault injection; fault modeling; fault simulation; fault-based tests; micromachining defects; next generation chips embedding MEMS; simulation techniques; suspended thermal MEMS; thermal short; Circuit faults; Circuit testing; Costs; Manufacturing; Microelectronics; Micromachining; Micromechanical devices; Packaging; Production; Silicon;
Conference_Titel :
Test Conference, 1999. Proceedings. International
Conference_Location :
Atlantic City, NJ
Print_ISBN :
0-7803-5753-1
DOI :
10.1109/TEST.1999.805646
