Title :
Packaging technology for smart power applications
Author :
Neugebauer, C.A.
Author_Institution :
General Electric Corp. Res. & Dev., Schenectady, NY, USA
Abstract :
The author briefly reviews packaging technology for smart power applications. Attention is given to packaging for low to medium voltages and for high voltages; to protective networks; and to smart power hybrids
Keywords :
hybrid integrated circuits; integrated circuit technology; monolithic integrated circuits; packaging; power integrated circuits; protection; HV type; IC; LV type; MV type; high voltages; packaging technology; protective networks; smart power applications; smart power hybrids; Ceramics; Costs; Dielectric breakdown; Electronics packaging; Heat sinks; Integrated circuit packaging; Logic devices; Low voltage; Pins; Plastic packaging;
Conference_Titel :
Power Semiconductor Devices and ICs, 1991. ISPSD '91., Proceedings of the 3rd International Symposium on
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-0009-2
DOI :
10.1109/ISPSD.1991.146057
