Improving the impact reliability of the Ni-doped solder joint by applying Cu-Zn under bump metallization

Author

Jenq-Gong Duh ; Wei-Yu Chen

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

130

Lastpage

134

Abstract

This study focuses on the correlation between the impact reliability and the interfacial reaction in Sn-3.0Ag-0.5Cu-0.1Ni/Cu (wt%) and Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joints. Adding Ni into the Sn-Ag-Cu solder can suppress the formation of Cu₃Sn and alter the morphology of the interfacial IMCs. Alternatively, replacing Cu substrates by Cu-Zn substrates can effectively limit the growth of Cu-Sn IMCs. In the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint, layer-type (Cu, Ni)₆(Sn, Zn)₅ is the dominate phase at the interface. Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint exhibits the thinner IMCs after aging for 500h. Due to the effective suppression of interfacial reaction, the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn joint significantly improve the impact reliability.

Keywords

copper alloys; electronics packaging; metallisation; nickel alloys; reliability; silver alloys; solders; tin alloys; zinc alloys; Sn-Ag-Cu-Ni-Cu; Sn-Ag-Cu-Ni-Cu-Zn; bump metallization; interfacial intermetallic compound morphology; interfacial reaction; solder joint impact reliability; Aging; Bonding; Joints; Nickel; Soldering; Substrates; Zinc; Cu-Zn alloy; High-speed shear test; Intermetallic compounds; Ni-doping; Phase transformation; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756439

Filename

6756439