Planarization of Passivation Layers during Manufacturing Processes of Image Sensors

Author

Sheikholeslami, Alireza ; Selberherr, Siegfried ; Parhami, Farnaz ; Puchner, Helmut

Author_Institution

Inst. for Microelectron., Wien

fYear

2006

fDate

Sept. 2006

Firstpage

35

Lastpage

36

Abstract

Image sensor processes are sensitive to passivation planarization which prevents clear layer coating issues and shortens the optical path between color filter and active surface. We present analysis of the deposition of passivation layers into trenches of image sensors. The simulation results are obtained by using the topography simulator ELSA (Enhanced Level Set Applications). We predict a range of trench width, stack height, and the thickness of the deposited layers leading to a sufficient planarization margin

Keywords

image sensors; manufacturing processes; optical films; optical filters; passivation; planarisation; ELSA; active surface; clear layer coating; color filter; enhanced level set application; image sensors; manufacturing process; optical path; passivation layer deposition; planarization; topography simulator; Active filters; Coatings; Color; Image sensors; Manufacturing processes; Optical filters; Optical sensors; Passivation; Planarization; Surface topography;

fLanguage

English

Publisher

ieee

Conference_Titel

Numerical Simulation of Semiconductor Optoelectronic Devices, 2006. NUSOD '06. International Conference on

Conference_Location

Nanyang Technological University, Nanyang Executive Centre, Singapore, China

Print_ISBN

0-7803-9755-X

Type

conf

DOI

10.1109/NUSOD.2006.306728

Filename

4098768