Phase evolution at the interface of SnAgCu/FeNi solder joint during solid state aging

Author

Zhi-Quan Liu ; Hao Zhang ; Li Zhang ; Hongyan Guo ; Chi-Ming Lai

Author_Institution

Shenyang Nat. Lab. for Mater. Sci., Inst. of Metal Res., Shenyang, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

260

Lastpage

263

Abstract

Chip scale packaging (CSP) samples with Fe-Ni UBM barrier layer were successfully fabricated by actual process. Solid interfacial reactions between SAC105 and three kinds of Fe-Ni UBM barrier layers of different composition had been investigated to clarify the phase evolution of Fe-Ni/SAC solder joints. Microstructural investigation revealed that after reflow only a thin FeSn₂ layer was formed on Fe-30Ni and Fe-50Ni substrate, while granular-like CuNiSn IMC was observed on FeSn₂ layer for Fe-75Ni solder joint. During solid-state aging, Fe-75Ni films exhibited an obvious IMC growth, while Fe-50Ni and Fe-30Ni films could endure longer time. the outer CuNiSn IMC will transform into (Cu, Ni)₆Sn₅ compound during thermal aging, which could be accelerated by the prolonging of aging time, the increasing of aging temperature, as well as the decreasing of Fe content in the film.

Keywords

ageing; chip scale packaging; copper alloys; electroplating; iron alloys; nickel alloys; reflow soldering; silver alloys; solders; thermal expansion; tin alloys; SnAgCu-FeNi; barrier layer; chip scale packaging; microstructural investigation; phase evolution; solder joint; solid interfacial reactions; solid state aging; thermal aging; Aging; Compounds; Morphology; Nickel; Soldering; Tin; Fe-Ni alloy; IMC; Phase evolution; UBM;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756467

Filename

6756467