DocumentCode
3477601
Title
Ion implant related trends in devices and process engineering
Author
Greenwell, David W. ; Brown, Robert L.
Author_Institution
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear
1996
fDate
16-21 Jun 1996
Firstpage
1
Lastpage
4
Abstract
This paper explores the trends for implant technology driven by the scaling of devices to smaller geometries. The progression conforms to the 1994 Silicon Industry Association (SIA) roadmap projections. The discussion moves from device structure to process constraints to implant tool requirements
Keywords
ion implantation; Silicon Industry Association roadmap; device scaling; ion implantation technology; process engineering; Annealing; Conducting materials; Contamination; Geometry; Implants; Indium; Isolation technology; Microelectronics; Silicon; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location
Austin, TX
Print_ISBN
0-7803-3289-X
Type
conf
DOI
10.1109/IIT.1996.586096
Filename
586096
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