Rapid process recipe optimization for batch thermal reactors

Describes a method for rapidly optimizing the uniformity of thin films deposited or grown on semiconductor wafers in batch thermal reactors. The method allows process recipes to be automatically optimized in as few as two process runs. Challenges associated with optimizing process recipes to yield uniform final film thickness on all wafers processed in each batch are presented, and the uniformity problem is formulated as a run-to-run control problem. A solution to this problem is presented that includes a run-to-run process model, an estimator, and a controller. This solution has been implemented in a software package that is used by engineers in the field to optimize process recipes. Measured results are presented from the optimization of two different process recipes