Title :
Effect of wetting agent on the properties of thermal grease with Al based fillers
Author :
Ling Zhang ; Zhi Zhang ; Pengli Zhu ; Kai Zhang ; Xianzhu Fu ; Rong Sun ; Yuen, M.M.F. ; Wong, C.P.
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
Thermal grease have numerous commercial and industrial applications in microelectronics, circuit board, heat exchangers, machinery, and appliances. A high loading of thermally conductive filler is essential to acquire a significant increase of thermal conductivity. In this paper, the alkyl silicone oil as a wetting agent was introduced into thermal grease in order to improve the filler loading. The effects of wetting agent on the thermal conductivity, thermal impedance, viscosity of Al, Al2O3, and AlN filled thermal grease were investigated, respectively. It is found that the loading of fillers can be effectively increased by alkyl silicone oil, leading to increased thermal conductivity and reduced thermal impedance of thermal grease.
Keywords :
alumina; aluminium; composite materials; disperse systems; greases; oils; silicones; thermal conductivity; viscosity; wetting; Al; Al2O3; AlN; alkyl silicone oil; aluminum based fillers; appliances; circuit board; filler loading; heat exchangers; machinery; microelectronics; thermal conductivity; thermal grease property; thermal impedance; thermally conductive filler; viscosity; wetting agent effect; Aluminum oxide; Conductivity; Electronic packaging thermal management; Impedance; Loading; Thermal conductivity; Thermal loading; Al based fillers; thermal conductivity; thermal grease; thermal impedance; viscosity;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756477
