DocumentCode
3479134
Title
Novel Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz Bands
Author
Shimizu, Hiroshi
Author_Institution
Hitachi Chem. Co. Ltd., Ibaraki
fYear
2007
fDate
Jan. 16 2007-Yearly 18 2007
Firstpage
63
Lastpage
66
Abstract
With the evolution of information technology, the frequency applied to electronic devices has become higher to handle the growing volumes of data. Signals on printed wiring boards (PWBs) used in these applications have come to adapt higher frequencies. At higher frequencies signal will attenuate more easily. The important problem in high-frequency circuits is the way to reduce the transmission loss on PWBs. We have developed novel low-transmission-loss multilayer materials suitable for PWBs applied to high GHz bands. The laminates made with new resins have good dielectric properties and show the same level of low dissipation factor as the PTFE laminate. Moreover, they have high Tg, low moisture absorption, and good heat resistance suited for the lead-free soldering process.
Keywords
dielectric materials; laminates; multilayers; printed circuits; PWB; electronic devices; heat resistance; high-frequency circuits; laminates; lead-free soldering process; low dissipation factor; low moisture absorption; low-transmission-loss multilayer material; printed wiring boards; resins; Circuits; Dielectric materials; Frequency; Information technology; Laminates; Moisture; Nonhomogeneous media; Propagation losses; Resins; Wiring; Substrate; high-frequency; material; printed wiring boards;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location
Odaiba, Tokyo
Print_ISBN
978-1-4244-1186-3
Electronic_ISBN
978-1-4244-1186-3
Type
conf
DOI
10.1109/POLYTR.2007.4339139
Filename
4339139
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