• DocumentCode
    3479134
  • Title

    Novel Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz Bands

  • Author

    Shimizu, Hiroshi

  • Author_Institution
    Hitachi Chem. Co. Ltd., Ibaraki
  • fYear
    2007
  • fDate
    Jan. 16 2007-Yearly 18 2007
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    With the evolution of information technology, the frequency applied to electronic devices has become higher to handle the growing volumes of data. Signals on printed wiring boards (PWBs) used in these applications have come to adapt higher frequencies. At higher frequencies signal will attenuate more easily. The important problem in high-frequency circuits is the way to reduce the transmission loss on PWBs. We have developed novel low-transmission-loss multilayer materials suitable for PWBs applied to high GHz bands. The laminates made with new resins have good dielectric properties and show the same level of low dissipation factor as the PTFE laminate. Moreover, they have high Tg, low moisture absorption, and good heat resistance suited for the lead-free soldering process.
  • Keywords
    dielectric materials; laminates; multilayers; printed circuits; PWB; electronic devices; heat resistance; high-frequency circuits; laminates; lead-free soldering process; low dissipation factor; low moisture absorption; low-transmission-loss multilayer material; printed wiring boards; resins; Circuits; Dielectric materials; Frequency; Information technology; Laminates; Moisture; Nonhomogeneous media; Propagation losses; Resins; Wiring; Substrate; high-frequency; material; printed wiring boards;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
  • Conference_Location
    Odaiba, Tokyo
  • Print_ISBN
    978-1-4244-1186-3
  • Electronic_ISBN
    978-1-4244-1186-3
  • Type

    conf

  • DOI
    10.1109/POLYTR.2007.4339139
  • Filename
    4339139