The interconnect reliability correlation with design and transportation stress

Reliability of compliant pin interconnects due to design parameter is critical to ensure product performance is maintained at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system are key successful factor in this regard. In additional transportation and material handling process of a server system will be affected by shock under certain conditions. Many accessories in the server system tend to become loose resulting in poor contact problems due to the severity of shock in the transportation and material handling processes. In this article, design variables such as pin hard-Au plating thickness, Mother Board locking mechanism and damping plat are experimented and reviewed. Also shocklog device is used to monitor the acceleration, duration and direction of shock realtime in large stationary or moving systems in transportation and transferring process. The data collected can be used to calculate the shock energy level. The comparison between the value of shock energy level and the criterion can be used to judge whether the shock can cause poor contact problems in transportation and transferring process. These design variables and stresses can be evaluated by drop test or vibration test to ensure system functional integrity is achieved.