• DocumentCode
    3479599
  • Title

    Present and Future Directions for Multichip Module Technologies

  • Author

    Toshio Sudo

  • Author_Institution
    Semiconductor Device Engineering Laboratory, Toshiba Corp.
  • fYear
    1994
  • fDate
    9-11 June 1994
  • Firstpage
    51
  • Lastpage
    54
  • Keywords
    Ceramics; Costs; Microprocessors; Multichip modules; Packaging; Semiconductor thin films; Sputtering; Substrates; Thin film circuits; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Circuits, 1994. Digest of Technical Papers., 1994 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-1918-4
  • Type

    conf

  • DOI
    10.1109/VLSIC.1994.586210
  • Filename
    586210
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3479599