DocumentCode :
3479871
Title :
Advanced Non-Soldering Interconnection
Author :
Buchoff, Leonard S.
Author_Institution :
Elastomeric Technologies Inc.
fYear :
1991
fDate :
16-18 April 1991
Firstpage :
248
Lastpage :
251
Abstract :
The number of soldered joints per circuit is rapidly increasing, especially on surface mounted boards. As a result, defective solder joints are becoming the dominant cause of board failures. Also, there is a move to closer spacing of connections which leads to solder bridging and difficulty of flux removal and joint inspection. These, coupled with other solder disadvantages, have led the military and industrial companies to look for alternative component connection methods. Because of the high cost of components and the circuit substrates it is mandatory to be able to replace defective parts easily.
Keywords :
Circuits; Clamps; Conductive adhesives; Immune system; Joining processes; Liquid crystal displays; Silver; Soldering; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro International, 1991
Conference_Location :
New York, NY, USA
Type :
conf
DOI :
10.1109/ELECTR.1991.718216
Filename :
718216
Link To Document :
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