Effects of Pb content on solidification behavior and microstructure on mixed solder alloy

Author

Wei Xiongfeng ; Li Xunping ; Zhou Bin ; Wei Guoqiang

Author_Institution

Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

903

Lastpage

906

Abstract

The influence of different Pb content on solidification behavior, formation and evolution of microstructure in mixed solder alloy were investigated. It has been shown that the onset temperature of DSC cooling curve decreased with increasing of Pb content or decreasing of solder ball´s volume. When Pb content in solder alloy reached 21.90wt.%, the solidification behavior of mixed solder alloy was dominated by eutectic Sn-Pb alloy. The addition of Pb resulted in the coarsening of dentritic β-Sn in solder matrix significantly, and the addition of Pb resulted in the formation of a low melting temperature Sn-Ag-Pb ternary eutectic alloy easily.

Keywords

eutectic alloys; lead alloys; solders; solidification; tin alloys; DSC cooling curve; Pb; Sn; low melting temperature; microstructure; mixed solder alloy; solder ball volume; solidification behavior; ternary eutectic alloy; Cooling; Electronics packaging; Lead; Microstructure; Reliability; Soldering; Pb content; Sn-Ag-Pb eutectic phase; microstructure; mixed solder alloy; solidification behavior;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756607

Filename

6756607