DocumentCode :
3480836
Title :
A new measurement system of very high temperature in atomic pile using ultrasonic delay time
Author :
Koo, Kil-MO ; Jeong, Dong-Gyu ; Choi, Jong-Ho ; Ko, Duck-Young
Author_Institution :
Korea Atomic Energy Res. Inst., Taejeon, South Korea
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
860
Abstract :
The temperature measurement of very high temperature core melt is of importance in LAVA (lower-plenum Arrested Vessel Attack) experiment in which gap formation between core melt and the reactor lower head, and the effect of the gap on thermal behavior are to be measured. The existing temperature measurement techniques have some problems, which the thermocouple, one of the contact methods, is restricted to under 2000°C, and the infrared thermometry, one of the non-contact methods, is unable to measure an internal temperature and very sensitive to the interference from reacted gases. So, in order to solve these problems, the delay time of ultrasonic wavelets due to high temperature is suggested. As a first stage, a molten material temperature was measured up to 2000°C. Also, the optimization design of the UTS (ultrasonic temperature sensor) with persistence at the high temperature was suggested in this paper. And the utilization of the theory suggested in this paper and the efficiency of the developed system are certified by performing experiments
Keywords :
fission reactor instrumentation; high-temperature techniques; temperature measurement; ultrasonic measurement; 2000 C; LAVA; atomic pile; core melt; design optimization; high temperature measurement system; lower-plenum arrested vessel attack; ultrasonic delay time; ultrasonic temperature sensor; Atomic measurements; Delay effects; Design optimization; Gases; Inductors; Interference; Propagation delay; Temperature measurement; Temperature sensors; Ultrasonic variables measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2001. Proceedings of IEEE Region 10 International Conference on Electrical and Electronic Technology
Print_ISBN :
0-7803-7101-1
Type :
conf
DOI :
10.1109/TENCON.2001.949717
Filename :
949717
Link To Document :
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