DocumentCode
3481069
Title
Biodegradable material options for industrial and goods packaging
Author
Azlan, Mohd ; David, N.V.
Author_Institution
Fac. of Mech. Eng., Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
fYear
2011
fDate
5-6 Dec. 2011
Firstpage
23
Lastpage
27
Abstract
Packaging materials for logistical purposes are designed to protect electrical and electronic products and other fragile consumer goods from damages due to shock and excessive vibrations during handling and transportation. There is recently an increased concern for the development of not only well-designed but also sustainable materials. Material sustainability is often associated with the extraction of renewable resources and disposal procedures that would not damage our ecosystem. In this respect, indigenous agro-waste resources would be a smart alternative to fabricate lightweight and disposable green-materials at low cost. This paper highlights some of the key utilities or functions of packaging materials and the commercially available packaging materials in the market at present. The prospect of biodegradable materials including indigenous natural fibers and an example of completely compostable commercial packaging material are outlined. Preliminary results of shock cushioning test on (surface-modified) kenaf filled polypropylene composites prepared in this study indicated that the 20% optimum content was the best cushioning are presented.
Keywords
biodegradable materials; composite materials; packaging; polymers; sustainable development; biodegradable material option; disposal procedure; electrical product; electronic product; excessive vibration; fragile consumer goods; goods packaging; green-materials; handling; indigenous agro-waste resource; industrial packaging; kenaf filled polypropylene composite; logistical purpose; material sustainability; packaging material; renewable resource extraction; shock; sustainable materials; transportation; Biodegradable materials; Electric shock; Natural fibers; Optical fiber devices; Packaging; Positron emission tomography; bio-waste; biodegradable fibers; kenaf; packaging material; polymer composites; shock cushioning;
fLanguage
English
Publisher
ieee
Conference_Titel
Humanities, Science and Engineering (CHUSER), 2011 IEEE Colloquium on
Conference_Location
Penang
Print_ISBN
978-1-4673-0021-6
Type
conf
DOI
10.1109/CHUSER.2011.6163725
Filename
6163725
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