• DocumentCode
    348108
  • Title

    Financial comparison of 200 mm vs. 300 mm IC manufacturing facilities

  • Author

    Duley, James K. ; Johnson, Dlake E. ; O´Halloran, M.

  • Author_Institution
    Hewlett-Packard Co., Palo Alto, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    27
  • Lastpage
    30
  • Abstract
    This paper compares the cost structure, optimal deployment policies, expected values and financial risk of 200 mm and 300 mm IC manufacturing facilities. 300 mm facilities are shown to have significantly lower capital costs than 200 mm facilities of comparable size (measured by die output), but comparable fixed recurring costs, and measurably higher variable costs. Due to the dominant role of capital costs in IC manufacturing, 300 mm fabs are significantly more valuable than comparably sized 200 mm fabs. The manufacturer´s optimal policy is to outsource production until demand reaches a level at which additional in-house capacity can be fully utilized with high probability, and then to add a large, sequentially deployable 300 mm facility
  • Keywords
    integrated circuit economics; 200 mm; 300 mm; IC manufacturing facility; cost structure; deployment policy; financial analysis; semiconductor wafer size; Cost function; Large Hadron Collider; Manufacturing industries; Outsourcing; Production facilities; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808730
  • Filename
    808730