DocumentCode
348108
Title
Financial comparison of 200 mm vs. 300 mm IC manufacturing facilities
Author
Duley, James K. ; Johnson, Dlake E. ; O´Halloran, M.
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1999
fDate
1999
Firstpage
27
Lastpage
30
Abstract
This paper compares the cost structure, optimal deployment policies, expected values and financial risk of 200 mm and 300 mm IC manufacturing facilities. 300 mm facilities are shown to have significantly lower capital costs than 200 mm facilities of comparable size (measured by die output), but comparable fixed recurring costs, and measurably higher variable costs. Due to the dominant role of capital costs in IC manufacturing, 300 mm fabs are significantly more valuable than comparably sized 200 mm fabs. The manufacturer´s optimal policy is to outsource production until demand reaches a level at which additional in-house capacity can be fully utilized with high probability, and then to add a large, sequentially deployable 300 mm facility
Keywords
integrated circuit economics; 200 mm; 300 mm; IC manufacturing facility; cost structure; deployment policy; financial analysis; semiconductor wafer size; Cost function; Large Hadron Collider; Manufacturing industries; Outsourcing; Production facilities; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
0-7803-5403-6
Type
conf
DOI
10.1109/ISSM.1999.808730
Filename
808730
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