• DocumentCode
    348125
  • Title

    A framework for extracting defect density information for yield modeling from in-line defect inspection for real-time prediction of random defect limited yields

  • Author

    Segal, Julie ; Gordon, Aaron ; Sajoto, Daan ; Duffy, Brian ; Kumar, Madan

  • Author_Institution
    HPL Inc., San Jose, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    403
  • Lastpage
    406
  • Abstract
    This paper describes a technique for filtering optically measured in-line defect densities (DDmeas) in order to arrive at defect densities (DDreal) which can be combined with critical areas to predict single layer random defect limited yield. The technique involves correlating in-line defects with bitmap failures to establish the relationship between the optically measured defect density and the defect density required for critical area based yield modeling. That relationship, once established, applies to logic devices as well as memories. This procedure can predict single layer random defect limited yields on a real-time basis as lots are inspected
  • Keywords
    digital integrated circuits; failure analysis; inspection; integrated circuit modelling; integrated circuit yield; bitmap failures; critical areas; defect density information; in-line defect inspection; optically measured in-line defect densities; random defect limited yields; real-time prediction; single layer random defect limited yields; yield modeling; Area measurement; Contacts; Data mining; Density measurement; Electrical fault detection; Inspection; Optical detectors; Predictive models; Random access memory; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808821
  • Filename
    808821