DocumentCode :
3481802
Title :
The effects of humidity and temperature aging test on flexible packaging LED module
Author :
Chunjing Hang ; Jingming Fei ; Yanhong Tian ; Wei Zhang ; Chunqing Wang ; Zhao, Sicong ; Caers, Jo
Author_Institution :
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
fYear :
2013
fDate :
11-14 Aug. 2013
Firstpage :
1126
Lastpage :
1129
Abstract :
LEDs are replacing incandescent bulbs in many fields particularly those requiring durability and low power consumption. The flexible packaged LED module could apply Surface light source, it is very useful in some special occasion. In some of these applications, as automotive and outside of the buildings, flexible packaged LEDs modules were exposed in extreme temperature and humidity conditions. In this paper, one thermal aging test and three thermal humidity aging tests were designed to investigate the reliability of flexible packaged LED modules. Main failure modes and mechanisms have been identified for the different aging test. Peck model was use to predict the degradation time of the LED modules.
Keywords :
LED lamps; ageing; electronics packaging; failure analysis; flexible electronics; Peck model; degradation time; failure modes; flexible packaging LED module; humidity conditions; humidity effect; surface light source; temperature aging test; thermal humidity aging tests; Aging; Degradation; Humidity; Light emitting diodes; Packaging; Phosphors; Reliability; LED; aging test; flexible packaging; life prediction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
Type :
conf
DOI :
10.1109/ICEPT.2013.6756656
Filename :
6756656
Link To Document :
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