• DocumentCode
    3484852
  • Title

    Fluorine effects in BF2+ implants at various energies

  • Author

    Felch, S.B. ; Lee, B.S. ; Downey, D.F. ; Zhao, Z. ; Eddy, R.J.

  • Author_Institution
    Varian Res. Center, Palo Alto, CA, USA
  • fYear
    1996
  • fDate
    16-21 Jun 1996
  • Firstpage
    611
  • Lastpage
    614
  • Abstract
    The effects of fluorine co-implanted with boron in BF2 + implants at conventional energies (50-80 keV) are well-known. These effects include the pile-up of fluorine in regions of residual damage near the boron peak, the amorphous/crystalline interface, and the end of range, and the formation of fluorine bubbles after annealing. However, ultra-low energy BF2+ implants (below 5 keV) and plasma-doped samples do not show any of these effects. In order to identify the transition where the fluorine effects disappear, a series of BF2+ implants at energies ranging from 2 to 50 keV and doses of 5×1014 to 5×1015 cm-2 were performed. The implants were rapidly annealed at temperatures of 900-1000°C for 30 s and then analyzed using SIMS and TEM. The results suggest a dependency of these undesirable fluorine effects on ion energy, implant dose, and anneal temperature
  • Keywords
    annealing; boron compounds; elemental semiconductors; ion implantation; secondary ion mass spectra; silicon; transmission electron microscopy; 2 to 50 keV; 900 to 1000 C; BF2+ ion implantation; SIMS; Si:BF2; TEM; amorphous/crystalline interface; annealing; bubbles; end of range; fluorine pile-up; residual damage; Amorphous materials; Boron; Crystallization; Electrical resistance measurement; Implants; Manufacturing; Plasma temperature; Rapid thermal annealing; Silicon; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. Proceedings of the 11th International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-3289-X
  • Type

    conf

  • DOI
    10.1109/IIT.1996.586474
  • Filename
    586474