Characterization of a high throughput implanter for the low temperature polysilicon AMLCD industry

The ORion 6072 implanter was introduced over one year ago. It exploits the cost advantages of a ribbon beam without mass analysis and achieves high throughput through active panel cooling in multiple load locks. During the past year we have gained considerable experience with these machines, both in our factory and in the field. We report here on extent to which the design goals have been met in practice. Specifically we provide data on phosphorous and boron dose accuracy and stability for source/drain, LDD and channel implants using both measurements made in situ, and SPC data on implanted samples (+/-5%), cooling rate (10s) and throughput (60/hr)