Title :
Multi-layer global routing considering via and wire capacities
Author :
Hsu, Chin-Hsiung ; Chen, Huang-Yu ; Chang, Yao-Wen
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
Abstract :
Global routing for modern large-scale circuit designs has attracted much attention in the recent literature. Most of the state-of-the-art academic global routers just work on a simplified routing congestion model that ignores the essential via capacity for routing through multiple metal layers. Such a simplified model would easily cause fatal routability problems in subsequent detailed routing. To remedy this deficiency, we present in this paper a more effective congestion metric that considers both the in-tile nets and the residual via capacity for global routing. With this congestion metric, we develop a new global router that features two novel routing algorithms for congestion optimization, namely least-flexibility-first routing and multi-source multi-sink escaping-point routing. The least-flexibility-first routing processes the nets with the least flexibility first, facilitating a quick prediction of congestion hot spots for the subsequent nets. Enjoying lower time complexity than traditional maze and A*-search routing, in particular, the linear-time escaping-point routing guarantees to find the optimal solution and achieves the theoretical lower-bound time complexity. Experimental results show that our global router can achieve very high-quality routing solutions with more reasonable via usage, which can benefit and correctly guide subsequent detailed routing.
Keywords :
circuit optimisation; network routing; A*-search routing; congestion metric; in-tile nets; large-scale circuit designs; least-flexibility-first routing; multi-layer global routing; multi-source multi-sink escaping-point routing; optimization; via-and-wire capacities; Circuit synthesis; Degradation; Design engineering; Design for manufacture; Large-scale systems; Manufacturing; Routing; Tiles; Transistors; Wire;
Conference_Titel :
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2819-9
Electronic_ISBN :
1092-3152
DOI :
10.1109/ICCAD.2008.4681597