• DocumentCode
    3487979
  • Title

    Temperature aware task sequencing and voltage scaling

  • Author

    Jayaseelan, Ramkumar ; Mitra, Tulika

  • Author_Institution
    Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    618
  • Lastpage
    623
  • Abstract
    On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of system design. In this paper, we propose task sequencing as a powerful and complimentary mechanism to voltage scaling in improving the thermal profile of an embedded system executing a set of periodic heterogenous tasks under timing constraints. We first derive the peak temperature of a repeating task sequence analytically and develop a heuristic to construct the task sequence that minimizes the peak temperature. Experimental evaluation shows that our task sequencing heuristic achieves peak temperature within 0.5degC of the optimal solution and 7.47degC lower, on an average, compared to the worst sequence for a large range of embedded task sets. We also propose an iterative algorithm that combines task sequencing with voltage scaling to further lower the peak temperature while satisfying the timing constraints. For embedded task sets, our combined task sequencing and voltage scaling approach achieves, on an average, 2.1degC - 6.94degC reduction in peak temperature compared to voltage scaling alone.
  • Keywords
    power aware computing; thermal management (packaging); on-chip power density; temperature aware task sequencing; voltage scaling; Cooling; Costs; Embedded system; Energy consumption; Packaging; Power system management; Temperature; Thermal management; Timing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4244-2819-9
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2008.4681641
  • Filename
    4681641