DocumentCode
3487979
Title
Temperature aware task sequencing and voltage scaling
Author
Jayaseelan, Ramkumar ; Mitra, Tulika
Author_Institution
Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
fYear
2008
fDate
10-13 Nov. 2008
Firstpage
618
Lastpage
623
Abstract
On-chip power density and temperature are rising exponentially with decreasing feature sizes. This alarming trend calls for temperature management at every level of system design. In this paper, we propose task sequencing as a powerful and complimentary mechanism to voltage scaling in improving the thermal profile of an embedded system executing a set of periodic heterogenous tasks under timing constraints. We first derive the peak temperature of a repeating task sequence analytically and develop a heuristic to construct the task sequence that minimizes the peak temperature. Experimental evaluation shows that our task sequencing heuristic achieves peak temperature within 0.5degC of the optimal solution and 7.47degC lower, on an average, compared to the worst sequence for a large range of embedded task sets. We also propose an iterative algorithm that combines task sequencing with voltage scaling to further lower the peak temperature while satisfying the timing constraints. For embedded task sets, our combined task sequencing and voltage scaling approach achieves, on an average, 2.1degC - 6.94degC reduction in peak temperature compared to voltage scaling alone.
Keywords
power aware computing; thermal management (packaging); on-chip power density; temperature aware task sequencing; voltage scaling; Cooling; Costs; Embedded system; Energy consumption; Packaging; Power system management; Temperature; Thermal management; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2008. ICCAD 2008. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-2819-9
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2008.4681641
Filename
4681641
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