Thin film VCSEL assembly on CMOS IC using ELO and nano paste metallization

Author

Kondo, Taka-Yuki ; Kitamura, Shojiro ; Nimura, Yoshihiko ; Kaneko, Takeo ; Shimoda, Tatsuya

Author_Institution

Seiko Epson Corp., Nagano, Japan

fYear

2004

fDate

28-30 June 2004

Firstpage

11

Lastpage

12

Abstract

In this work, we present the enhancement of previous work by monolithically appearance assembly using nano paste metallization on IC with Au plated pads and higher frequency operation. We have demonstrated the assembly of thin film VCSEL on CMOS laser driver IC in monolithically dimension. ELO (epitaxial liftoff) technique, polyimide bonding and nano paste metallization with Au plated pads were used for this work. The modulation of light output from thin film VCSEL at 2.5 Gbps was achieved.

Keywords

CMOS integrated circuits; gold; integrated optoelectronics; laser cavity resonators; optical fabrication; optical films; optical modulation; semiconductor device metallisation; semiconductor epitaxial layers; surface emitting lasers; 2.5 Gbit/s; Au; Au plated pads; CMOS laser driver IC; ELO; epitaxial liftoff; light modulation; monolithical assembly; nano paste metallization; polyimide bonding; thin film VCSEL assembly; Assembly; Bonding; CMOS integrated circuits; Frequency; Gold; Metallization; Monolithic integrated circuits; Polyimides; Transistors; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004 Digest of the LEOS Summer Topical Meetings

ISSN

1099-4742

Print_ISBN

0-7803-8306-0

Type

conf

DOI

10.1109/LEOSST.2004.1338680

Filename

1338680