Title :
Si-nanowire TAHOS (TaN/Al2O3/HfO2/SiO2/Si ) nonvolatile memory cell
Author :
Fu, J. ; Singh, N. ; Yang, B. ; Zhu, C.X. ; Lo, G.Q. ; Kwong, D.L.
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore
Abstract :
Silicon nanowire based discrete trapped charge-storage nonvolatile memory cell employing high-kappa dielectrics with metal gate is presented for the first time. The nanowire TAHOS (TaN/Al2O3/HfO2/SiO2/Si) memory fabricated using top-down method in nearly gate-all-around (GAA) architecture showed higher P/E speed than SONOS. In TAHOS, the erase speed is found almost equal to the program speed. The improvements are attributed to the reduced electrical oxide thickness (EOT) of the dielectric layers, increased electric field in tunnel oxide, deep trap levels in the HfO2 charge trapping layer, and suppression of gate electron injection by Al2O3 blocking layer. The fabricated nanowire TAHOS devices also exhibit large window after ten year of retention, achieving a better trade-off between long retention and fast program/erase property.
Keywords :
aluminium compounds; charge injection; deep levels; elemental semiconductors; hafnium compounds; high-k dielectric thin films; integrated memory circuits; nanowires; random-access storage; semiconductor quantum wires; semiconductor-insulator boundaries; silicon; silicon compounds; tantalum compounds; TaN-Al2O3-HfO2-SiO2-Si; charge trapping layer; deep trap levels; discrete trapped charge-storage nonvolatile memory cell; electrical oxide thickness; erase speed; gate electron injection suppression; high-k dielectrics; metal gate; nearly gate-all-around architecture; program speed; silicon nanowire TAHOS; Aluminum oxide; Dielectric devices; Electron traps; Fabrication; Hafnium oxide; Nanoscale devices; Nonvolatile memory; SONOS devices; Stress; Tunneling;
Conference_Titel :
Solid-State Device Research Conference, 2008. ESSDERC 2008. 38th European
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-2363-7
Electronic_ISBN :
1930-8876
DOI :
10.1109/ESSDERC.2008.4681712