Mixed circuit/electromagnetic analysis of field coupling to high speed interconnects in inhomogenous medium

Author

Erdin, Ihsan ; Nakhla, Michel

Author_Institution

Carleton Univ., Ottawa, Ont., Canada

Volume

1

fYear

1999

fDate

1999

Firstpage

446

Abstract

An efficient method is presented for rigorous analysis of incident field coupling to high speed interconnects. The method is based on generating time domain equivalent sources from incoming fields through finite difference time domain analysis (FDTD) and incorporating them with a circuit level simulator such as SPICE. With this approach, it is possible to perform a circuit analysis of arbitrarily shaped structures which are exposed to external fields. Moreover, the proposed method overcomes the numerical stability problems of FDTD when coupled with nonlinear terminations

Keywords

circuit simulation; electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; finite difference time-domain analysis; inhomogeneous media; interconnections; lumped parameter networks; nonlinear network analysis; numerical stability; FDTD method; SPICE; arbitrarily shaped structures; circuit analysis; circuit level simulator; external fields; field coupling; finite difference time domain analysis; high speed interconnects; incoming fields; inhomogenous medium; mixed circuit/electromagnetic analysis; nonlinear terminations; numerical stability problems; rigorous analysis; time domain equivalent sources; Analytical models; Circuit analysis; Circuit simulation; Coupling circuits; Electromagnetic analysis; Electromagnetic coupling; Finite difference methods; Integrated circuit interconnections; SPICE; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-5057-X

Type

conf

DOI

10.1109/ISEMC.1999.812945

Filename

812945