DocumentCode :
3490486
Title :
Stochastic finite element modeling of thermoelastic quality factor of micro-beams
Author :
Lepage, Severine ; Weickum, Gary ; Maute, Kurt
Author_Institution :
Beckman Inst., Univ. of Illinois at Urbana-Champaign, Urbana, IL
fYear :
2008
fDate :
20-23 April 2008
Firstpage :
1
Lastpage :
8
Abstract :
In the design of micro-electromechanical systems (MEMS) such as micro-resonators, one of the major dissipation phenomena to consider is thermoelastic damping. The performance of such MEMS is directly related to their thermoelastic quality factor which has to be predicted acurately. Moreover, the performance of MEMS depends on manufacturing processes which cause substantial uncertainty in the geometry and in the material properties of the device. The aim of this paper is to provide a framework to account for uncertainties in the hnite element analysis of thermoelastic damping in MEMS. Four stochastic methods are investigated: perturbation stochastic finite element method (SFEM), spectral SFEM, projection method and Monte-Carlo method. Due to the nature of the thermoelastic problem, these stochastic methods are extended to the resolution of non-symmetric damped eigenproblems. The methods are applied on the analysis of the thermoelastic quality factor of a micro-beam whose elastic modulus is considered as random.
Keywords :
Monte Carlo methods; Q-factor; damping; eigenvalues and eigenfunctions; elastic moduli; finite element analysis; geometry; micromechanical resonators; stochastic processes; thermoelasticity; Monte-Carlo method; elastic modulus; hnite element analysis; manufacturing processes; microbeams; microelectromechanical systems; microresonators; nonsymmetric damped eigenproblems; projection method; spectral SFEM; stochastic finite element modeling; thermoelastic damping; thermoelastic quality factor; Damping; Finite element methods; Geometry; Manufacturing processes; Microelectromechanical systems; Micromechanical devices; Q factor; Stochastic processes; Thermoelasticity; Uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
Type :
conf
DOI :
10.1109/ESIME.2008.4525068
Filename :
4525068
Link To Document :
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