DocumentCode :
3490509
Title :
Application of CFD modelling for energy efficient humidity management of an electronics enclosure in storage under severe climatic conditions
Author :
Belov, Ilja ; Rydén, Jan ; Lindeblom, Joakim ; Zhang, Yafan ; Hansson, Torgny ; Bergner, Fredrik ; Leisner, Peter
Author_Institution :
Sch. of Eng., Jonkoping Univ., Jonkoping
fYear :
2008
fDate :
20-23 April 2008
Firstpage :
1
Lastpage :
8
Abstract :
A CFD modelling methodology including experimental validation has been developed and applied for investigation of anti-moisture measures in a non- hermetic electronics enclosure containing a number of printed circuit boards, and placed in a severe storage environment. In the climatic test the temperature and the relative humidity have been varried from +33degC to +71degC and from 14% to 80%, respectively. Enclosure heater solutions have been parametrically studied by simulation. A heating strategy involving various power levels has been determined, which is just sufficient to maintain the internal relative humidity below 60%, thereby reducing the risk for dew formation on the electronics assembly.
Keywords :
assembling; computational fluid dynamics; electronics packaging; humidity; moisture; printed circuits; CFD modelling; antimoisture measures; electronics assembly; humidity management; nonhermetic electronics enclosure; printed circuit boards; Circuit simulation; Circuit testing; Computational fluid dynamics; Energy efficiency; Energy management; Energy storage; Heating; Humidity; Printed circuits; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
Type :
conf
DOI :
10.1109/ESIME.2008.4525069
Filename :
4525069
Link To Document :
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