Title :
Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application
Author :
Zéanh, A. ; Dalverny, O. ; Karama, M. ; Woirgard, E. ; Azzopardi, S. ; Bouzourene, A. ; Casutt, J. ; Mermet-Guyennet, M.
Author_Institution :
THALES Avionics Electr. Syst., Chatou
Abstract :
In this paper, an IGBT (Insulated Gate Bipolar Transistor) module for an aeronautic application was investigated using non-linear Finite Element Analysis (FEA). Two failure modes were considered: brittle materials fracture and solder joint thermomechanical fatigue. The module reliability regarding these failure modes was evaluated over the 40000 flight cycles required for the application, under the real loading profile. Acceleration Factors (AF) were also computed with respect to Accelerated Thermal Cycling (ATC) used during the module design qualification and validation.
Keywords :
brittleness; finite element analysis; insulated gate bipolar transistors; semiconductor device models; semiconductor device reliability; IGBT module; accelerated thermal cycling; acceleration factors; aeronautical application; brittle materials fracture; failure modes; insulated gate bipolar transistor; module design qualification; module design validation; nonlinear finite element analysis; reliability study; solder joint thermomechanical fatigue; thermomechanical modelling; Acceleration; Aerospace materials; Fatigue; Finite element methods; Insulated gate bipolar transistors; Joining materials; Qualifications; Soldering; Thermal factors; Thermomechanical processes; Power electronic packaging; aeronautic loadings; constitutive laws; failure criteria; reliability;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on
Conference_Location :
Freiburg im Breisgau
Print_ISBN :
978-1-4244-2127-5
Electronic_ISBN :
978-1-4244-2128-2
DOI :
10.1109/ESIME.2008.4525082
