DocumentCode
349275
Title
Packaging of integrated micro optical systems
Author
Han, Hongtao ; Mathews, Jay ; Stack, Jared ; Hammond, Barney
Author_Institution
Digital Opt. Corp., Charlotte, NC, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
90
Abstract
Wafer scale manufacturing techniques for making both multi-phase level diffractive optics and micro refractive optics feature low manufacturing cost, compact size, and light weight. The integration of the micro optics with lasers, detectors, and optical waveguides enables many new applications where size, weight, and cost are crucial. In this paper, we will report our results on the integrated micro optical systems (IMOS) which contain VCSEL array, detector array, edge emitting lasers, and fiber array for opto-electronic and fiber optic applications
Keywords
integrated circuit packaging; micro-optics; optical communication equipment; photodetectors; semiconductor laser arrays; surface emitting lasers; VCSEL array; compact size; detector array; detectors; edge emitting lasers; fiber array; fiber optic applications; integrated micro optical system packaging; integrated micro optical systems; lasers; light weight; low manufacturing cost; micro optics; micro refractive optics; multi-phase level diffractive optics; optical waveguides; optoelectronic applications; wafer scale manufacturing techniques; Costs; Fiber lasers; Integrated optics; Manufacturing; Optical arrays; Optical refraction; Packaging; Sensor arrays; Stimulated emission; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location
San Francisco, CA
ISSN
1092-8081
Print_ISBN
0-7803-5634-9
Type
conf
DOI
10.1109/LEOS.1999.813491
Filename
813491
Link To Document