• DocumentCode
    3492913
  • Title

    A higher-order mode transmission line model of the shielding effectiveness of enclosures with apertures

  • Author

    Belokour, I. ; LoVetri, J. ; Kashyap, S.

  • Author_Institution
    Tech. Center, Visteon Corp, Dearborn, MI, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    702
  • Abstract
    The development of efficient phenomenological models which give accurate estimates for the coupling of electromagnetic energy through apertures and into enclosures is important for the EMC design of almost all electronic sub-systems. It has been previously shown that a simple analytical transmission line formulation gives good predictions of the shielding effectiveness of a rectangular enclosure with apertures. In this work the model is extended to include higher-order transverse electric (TE) and transverse magnetic (TM) cavity modes in the transmission line (TL) model. The loading effect of electronic components within the enclosure is modelled by the introduction of losses. The model remains very simple and computationally efficient. The finite difference time-domain (FDTD) method is used to validate the results
  • Keywords
    electromagnetic compatibility; electromagnetic coupling; electromagnetic shielding; finite difference time-domain analysis; losses; transmission line theory; EMC design; FDTD method; electromagnetic energy coupling; electronic sub-systems; finite difference time-domain method; higher-order mode transmission line model; higher-order transverse electric cavity modes; higher-order transverse magnetic cavity modes; loading effect; losses; rectangular enclosure; shielding effectiveness; transmission line model; Apertures; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic shielding; Finite difference methods; Magnetic analysis; Tellurium; Time domain analysis; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    0-7803-6569-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2001.950458
  • Filename
    950458