DocumentCode :
3493876
Title :
In-depth Investigation of HfAlO Layers as Interpoly Dielectrics of Future Flash Memories
Author :
Molas, G. ; Grampeix, H. ; Buckley, J. ; Bocquet, M. ; Garros, X. ; Martin, F. ; Colonna, J.P. ; Brianceau, P. ; Vidal, V. ; Gély, M. ; De Salvo, B. ; Deleonibus, S. ; Bongiorno, C. ; Lombardo, S.
Author_Institution :
CEA-Leti, Grenoble
fYear :
2006
fDate :
Sept. 2006
Firstpage :
242
Lastpage :
245
Abstract :
In this work, the authors evaluate the potentialities of HfAlO materials as possible candidates for the interpoly dielectrics of future flash memory devices. HfAlO single-layer and oxide/HfAlO/oxide triple-layer stacks were processed and analyzed in terms of coupling and insulating capabilities. The electron conduction modes in these materials, at different temperatures, were also investigated. Finally, by means of analytical models matched with experimental data, the authors extrapolate the programming characteristics of future flash memory nodes integrating HfAlO as interpoly dielectrics
Keywords :
aluminium compounds; dielectric materials; flash memories; hafnium compounds; insulating materials; HfAlO; coupling capabilities; electron conduction modes; future flash memories; insulating capabilities; interpoly dielectrics; programming characteristics; triple-layer stacks; Analytical models; Capacitors; Conducting materials; Dielectric devices; Dielectric materials; Electrons; Flash memory; Hafnium; High K dielectric materials; High-K gate dielectrics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 2006. ESSDERC 2006. Proceeding of the 36th European
Conference_Location :
Montreux
ISSN :
1930-8876
Print_ISBN :
1-4244-0301-4
Type :
conf
DOI :
10.1109/ESSDER.2006.307683
Filename :
4099901
Link To Document :
بازگشت