DocumentCode
349478
Title
Diffusion and activation behaviors of boron by incorporated nitrogen ions in ammonia ambient
Author
Lee, Jung-Ho ; Lee, Kil-Ho ; Lee, Sahng-Kyoo
Author_Institution
Semicond. Adv. Res. Div., Hyundai Electron. Ind. Co. Ltd., Kyoungki, South Korea
Volume
2
fYear
1999
fDate
36495
Firstpage
947
Abstract
We investigated the diffusion and activation behaviors of BF2 implanted (15 keV, 2×1015 cm-2) samples annealed at 1000°C for 10 sec in different ambients (N2 /NH3) with respect to the presence or absence of the surface oxide. In presence of surface oxide, the sample annealed in ammonia ambient gives a shallower junction depth than one annealed in nitrogen ambient. From results of XPS and SIMS measurement, we analyzed the mechanism of nitrogen incorporation in ammonia ambient through the possibility of microetching reactions that can be driven by the ammonia radicals and the surface oxide
Keywords
X-ray photoelectron spectra; annealing; diffusion; doping profiles; elemental semiconductors; impurity distribution; ion implantation; secondary ion mass spectra; semiconductor doping; silicon; 10 s; 1000 C; NH3; SIMS; Si:BF2,N; XPS; activation behavior; ammonia ambient; diffusion; microetching reactions; shallower junction dept; surface oxide; Boron; Chemical vapor deposition; Dielectrics; Hydrogen; Lattices; Nitrogen; Random access memory; Rapid thermal annealing; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1998.813834
Filename
813834
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