• DocumentCode
    349478
  • Title

    Diffusion and activation behaviors of boron by incorporated nitrogen ions in ammonia ambient

  • Author

    Lee, Jung-Ho ; Lee, Kil-Ho ; Lee, Sahng-Kyoo

  • Author_Institution
    Semicond. Adv. Res. Div., Hyundai Electron. Ind. Co. Ltd., Kyoungki, South Korea
  • Volume
    2
  • fYear
    1999
  • fDate
    36495
  • Firstpage
    947
  • Abstract
    We investigated the diffusion and activation behaviors of BF2 implanted (15 keV, 2×1015 cm-2) samples annealed at 1000°C for 10 sec in different ambients (N2 /NH3) with respect to the presence or absence of the surface oxide. In presence of surface oxide, the sample annealed in ammonia ambient gives a shallower junction depth than one annealed in nitrogen ambient. From results of XPS and SIMS measurement, we analyzed the mechanism of nitrogen incorporation in ammonia ambient through the possibility of microetching reactions that can be driven by the ammonia radicals and the surface oxide
  • Keywords
    X-ray photoelectron spectra; annealing; diffusion; doping profiles; elemental semiconductors; impurity distribution; ion implantation; secondary ion mass spectra; semiconductor doping; silicon; 10 s; 1000 C; NH3; SIMS; Si:BF2,N; XPS; activation behavior; ammonia ambient; diffusion; microetching reactions; shallower junction dept; surface oxide; Boron; Chemical vapor deposition; Dielectrics; Hydrogen; Lattices; Nitrogen; Random access memory; Rapid thermal annealing; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology Proceedings, 1998 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-7803-4538-X
  • Type

    conf

  • DOI
    10.1109/IIT.1998.813834
  • Filename
    813834