Title :
AlN film growth under N2+ ion bombardment onto Al surface
Author :
Mitsuhashi, R. ; Beag, Y.W. ; Zhou, G. ; Shimizu, R.
Author_Institution :
Dept. of Appl. Phys., Osaka Univ., Japan
Abstract :
Incident energy dependence of crystallization of AlN prepared by low energy ion implantation was investigated. The experiment was performed at room temperature as follows: First, the Al film of thickness of ~3000 Å was deposited onto Si(100) surface. Then, the Al surface was bombarded with N2+ ions at normal incidence with a current density of ~4×1013 ions/cm2 sec. Primary energy was changed from 500 eV to 15 keV. The base pressure of the experimental apparatus was 3×10-7 Pa in the main chamber and ion beam irradiation deteriorated the vacuum to ~4×10-6 Pa. The surface structure was observed by reflection high-energy electron diffraction (RHEED) during ion bombardment. For primary energies beyond ~3 keV, the fiber texture of AlN wurtzite structure was observed by RHEED whilst a polycrystalline AlN was observed for primary energies below ~3 keV. The RHEED-observation has revealed that direction of the fiber axis is normal to the surface, along with the direction of the incident ion beam. The result indicates that the higher the primary energy the better the crystallinity of AlN film
Keywords :
III-V semiconductors; aluminium compounds; crystallisation; current density; ion implantation; reflection high energy electron diffraction; semiconductor thin films; surface structure; texture; 293 K; Al surface; Al:N; AlN; N2+ ion bombardment; RHEED; Si; Si(100) surface; crystallization; current density; fiber texture; incident energy dependence; low energy ion implantation; surface structure; thin film; wurtzite structure; Electrons; Inorganic materials; Insulation; Ion beams; Piezoelectric films; Piezoelectric materials; Sputtering; Substrates; Surface structures; Voltage;
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
DOI :
10.1109/IIT.1998.813866