DocumentCode
3495663
Title
Microassembly of MEMS actuators and sensors via micro-masonry
Author
Zhang, Ye ; Keum, Hohyun ; Kim, Sungho
Author_Institution
Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
fYear
2013
fDate
20-24 Jan. 2013
Firstpage
283
Lastpage
286
Abstract
Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.
Keywords
bonding processes; microactuators; microassembling; microfabrication; microsensors; rapid thermal annealing; MEMS devices; MEMS mechanical actuators; MEMS mechanical sensors; direct bonding; elastomeric microtipped stamps; manipulation tool; microassembly technique; microfabrication process; micromasonry technique; rapid thermal annealing; retrievable MEMS components; switchable dry adhesion; transfer printing; Adhesives; Assembly; Fingers; Gold; Micromechanical devices; Resists; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location
Taipei
ISSN
1084-6999
Print_ISBN
978-1-4673-5654-1
Type
conf
DOI
10.1109/MEMSYS.2013.6474233
Filename
6474233
Link To Document