• DocumentCode
    3495663
  • Title

    Microassembly of MEMS actuators and sensors via micro-masonry

  • Author

    Zhang, Ye ; Keum, Hohyun ; Kim, Sungho

  • Author_Institution
    Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    Micro-masonry is a microassembly technique that is based on transfer printing and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators based on this micro-masonry technique. Microfabrication processes for retrievable MEMS components (e.g., combs, flexure beams, and metal pads) are developed. As manipulation tools, elastomeric microtipped stamps with switchable dry adhesion are also designed and fabricated to pick up and place those components. After the assembly, the components are permanently bonded together via rapid thermal annealing. The sensing and actuating capabilities of the assembled MEMS devices are characterized.
  • Keywords
    bonding processes; microactuators; microassembling; microfabrication; microsensors; rapid thermal annealing; MEMS devices; MEMS mechanical actuators; MEMS mechanical sensors; direct bonding; elastomeric microtipped stamps; manipulation tool; microassembly technique; microfabrication process; micromasonry technique; rapid thermal annealing; retrievable MEMS components; switchable dry adhesion; transfer printing; Adhesives; Assembly; Fingers; Gold; Micromechanical devices; Resists; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474233
  • Filename
    6474233