• DocumentCode
    3496162
  • Title

    Verification of bending strength of vapor-liquid-solid grown high-aspect-ratio silicon-neuroprobes

  • Author

    Imashioya, T. ; Oi, H. ; Yagi, S. ; Ishida, Makoto ; Kawano, T.

  • Author_Institution
    Dept. of Electr. & Electron. Inf. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    365
  • Lastpage
    368
  • Abstract
    MEMS-based penetrating probe electrode devices have opened a new class of multi-site electrophysiological recordings of neurons/cells in a tissue with a high spatial resolution. Although these probes becomes a powerful tool in electrophysiology, the challenge still remains the tissue penetrations with small diameter probes for further low-invasive and safe tissue penetrations. However, it is difficult to penetrate small diameter probes with a high aspect ratio (e.g., a micro-scale diameter probe with the length of several hundred microns or more), due to the buckling of the probe during the tissue penetration (Fig.1). To realize the tissue penetration with small diameter needle with a high aspect ratio, quantitative discussions of the penetration force and the buckling/bending properties of the probe are further required. Here we verify the bending strength of silicon-microprobe with a high aspect ratio using in situ force-measurement-system (FMS) inside the SEM. In addition, these silicon probes are coated with a metal of iridium (Ir) with a high Young´s modulus as the exoskeleton (shell), quantitatively confirming the increased stiffness of the probe. Such data can be used to design stiff probes and realize the minimization of the probe diameter, enhancing the penetrating capability of small probes for further low-invasive and safe tissue penetrations.
  • Keywords
    bending strength; biomedical electrodes; microelectrodes; micromechanical devices; neurophysiology; silicon; FMS; MEMS based penetrating probe electrode devices; SEM; Si; Young modulus; bending strength; electrophysiology; high aspect ratio silicon neuroprobes; high spatial resolution; in situ force measurement system; microscale diameter probe; multisite electrophysiological recording; penetration force; silicon microprobe; tissue penetration; vapor liquid solid growth; Electrodes; Metals; Micromechanical devices; Numerical analysis; Probes; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474254
  • Filename
    6474254