• DocumentCode
    3496366
  • Title

    Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement

  • Author

    Lin, Yen-Hui ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    319
  • Abstract
    Taking four kinds of imperfect ground planes as examples, the effect of the imperfect ground plane on the signal integrity (SI) and electromagnetic interference (EMI) for high-speed digital transmission line on the printed circuit boards (PCB) are investigated both by FDTD simulation and experimental measurement. It is found that good signal quality does not guarantee good EMI performance and ill signal integrity does not imply severe radiated emission. The dominant factor that affects the EMI performance of the signal trace on the reference plane is the path of return current. All simulated S-parameter and EMI behavior of the signal traces are compared with the measurement results. The agreement between them is good
  • Keywords
    S-parameters; electromagnetic interference; finite difference time-domain analysis; microstrip lines; printed circuits; transmission line theory; EMI; EMI performance; FDTD simulation; PCB; bypass capacitor influence; electromagnetic interference; high-speed digital transmission line; ill signal integrity; imperfect ground planes; microstrip line; printed circuit boards; radiated emission; return current path; signal integrity; signal quality; signal trace; signal traces; simulated EMI behavior; simulated S-parameter behavior; Circuit simulation; Distributed parameter circuits; Electromagnetic interference; Electromagnetic measurements; Finite difference methods; Microstrip; Printed circuits; Scattering parameters; Time domain analysis; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    0-7803-6569-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2001.950649
  • Filename
    950649