Hybrid FDTD-SPICE analysis of radiated emission from PCB with integrated circuits

Author

Nishizawa, A. ; Kobidze, G. ; Tanabe, S.

Author_Institution

Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan

Volume

1

fYear

2001

fDate

2001

Firstpage

559

Abstract

The radiated emission from ground bouncing and transmission lines have been analyzed using the finite difference time domain (FDTD) and SPICE hybrid method. This method can consider both the nonlinear electric characteristics of IC and the distributed parameters of printed circuit boards (PCB). The computed results of the electric field at 3 m from the PCB were validated by the measurements. The hybrid tool allows calculation of the noise spectrum and radiation pattern. Another advantage is that this method can separate the contributions of various noise sources. This analysis tool and methodology is useful to design transmission lines and power/ground planes in PCB

Keywords

SPICE; electric fields; electromagnetic interference; finite difference time-domain analysis; integrated circuit modelling; printed circuits; 3 m; EMI; PCB; distributed parameters; electric field; electromagnetic interference; finite difference time domain; ground bouncing; hybrid FDTD-SPICE analysis; integrated circuits; noise sources; noise spectrum calculation; nonlinear electric characteristics; power/ground planes design; radiated emission; radiation pattern; transmission lines; Distributed parameter circuits; Electric variables; Electric variables measurement; Finite difference methods; Integrated circuit noise; Power transmission lines; Printed circuits; SPICE; Time domain analysis; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950704

Filename

950704