DocumentCode :
3499815
Title :
High-sensitivity erectrochemical sensor using pyrolyzed polymer-gold 3D probe arrays for spatial chemical sensing
Author :
Tonomura, W. ; Mori, Yojiro ; Konishi, Satoshi
Author_Institution :
Ritsumeikan Univ., Kusatsu, Japan
fYear :
2013
fDate :
20-24 Jan. 2013
Firstpage :
1011
Lastpage :
1014
Abstract :
This paper reports spatially arranged pyrolyzed polymer-gold probes to allow high-sensitivity monitoring of spatially distributed chemicals. Pyrolyzed polymer is a promising carbon material for applications of electrochemical sensors. Out-of-plane gold microelectrodes coated by polymer film (parylene-C) are transformed to conductive carbon-gold materials by annealing at 1000°C for 2h in a vacuum chamber. 3D probe technology using wire bonding makes it possible to provide the spatially arranged microelectrodes. This paper demonstrates pyrolyzed polymer-gold 3D probes have high sensitivity and wider electrochemical potential window than typical electrochemical electrode materials such as gold to realize spatial chemical sensing.
Keywords :
annealing; electrochemical electrodes; electrochemical sensors; gold; lead bonding; microelectrodes; polymers; pyrolysis; 3D probe technology; annealing; carbon material; conductive carbon-gold materials; electrochemical electrode materials; electrochemical potential window; high-sensitivity electrochemical sensor; high-sensitivity monitoring; out-of-plane gold microelectrodes; parylene-C; polymer film coating; pyrolyzed polymer-gold 3D probe arrays; spatial chemical sensing; spatially-arranged microelectrodes; spatially-arranged pyrolyzed polymer-gold probes; spatially-distributed chemicals; temperature 1000 degC; time 2 h; vacuum chamber; wire bonding; Carbon; Chemicals; Electrodes; Gold; Polymers; Probes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
ISSN :
1084-6999
Print_ISBN :
978-1-4673-5654-1
Type :
conf
DOI :
10.1109/MEMSYS.2013.6474419
Filename :
6474419
Link To Document :
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