A roadmap for the implementation of total productive maintenance (TPM) in semiconductor manufacturing operations

Total productive maintenance (TPM) methods and tools are being applied in a silicon wafer fabrication facility as a part of continuous improvement efforts to achieve manufacturing competitiveness. In this paper, TPM basic concepts are summarized, followed by a detailed description of a 5-phase roadmap developed for effective implementation of the TPM process. The roadmap includes: (1) an awareness program to obtain management commitment and support; (2) a restructuring of the manufacturing organization to integrate maintenance in production modules; (3) planning maps to cover TPM activities related to equipment effectiveness, maintenance management system, workplace and workforce improvements; (4) an implementation process based on the work of cross-functional, multi-skill, self-directed teams; and (5) an assessment process to ´close loop´ the implementation process and define directions for continuous improvements. The status of TPM implementation in the organization is the reviewed in terms of accomplishments made in improving equipment effectiveness, equipment maintenance system, workplace environment and workforce knowledge and skills. Finally, logistic issues encountered during the implementation process are presented along with actions taken to deal with these issues.