Substrate and metallization selection for high power hybrid circuits based on thermal resistance and temperature cycling reliability

Author

Dalal, Kiran

Author_Institution

Brush Wellman Inc., Cleveland, OH, USA

fYear

1991

fDate

10-15 Mar 1991

Firstpage

347

Lastpage

354

Abstract

Thermal resistance literature for materials systems used in high-power hybrid modules is reviewed. Based on the review, beryllia appears to be the best choice for a ceramic substrate material followed by aluminium nitride. Thick-film metallization and other copper metallization systems for beryllia substrates have been evaluated for aged adhesion and temperature cycling reliability. Results indicate that beryllia substrates with directly bonded copper metallization present the best choice of materials system to address thermal resistance and thermal aging as well as temperature cycling reliability issues in the high-power hybrid circuits

Keywords

ageing; ceramics; hybrid integrated circuits; integrated circuit technology; metallisation; power integrated circuits; reliability; substrates; testing; thermal analysis; BeO; Cu; adhesion; beryllia; ceramic; hybrid circuits; metallization; power IC; power electronics; temperature cycling reliability; thermal aging; thermal analysis; thermal resistance; Adhesives; Aging; Aluminum; Bonding; Ceramics; Copper; Inorganic materials; Metallization; Temperature; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1991. APEC '91. Conference Proceedings, 1991., Sixth Annual

Conference_Location

Dallas, TX

Print_ISBN

0-7803-0024-6

Type

conf

DOI

10.1109/APEC.1991.146193

Filename

146193