DocumentCode
3501369
Title
Process window and device variations evaluation using array-based characterization circuits
Author
Tabery, C. ; Craig, M. ; Burbach, G. ; Wagner, B. ; McGowan, S. ; Etter, P. ; Roling, S. ; Haidinyak, C. ; Ehrichs, E.
Author_Institution
Adv. Micro Devices, Sunnyvale, CA
fYear
2006
fDate
27-29 March 2006
Lastpage
265
Abstract
Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools
Keywords
design for manufacture; integrated circuit design; process monitoring; proximity effect (lithography); OPC qualification; OPC refinement; array-based characterization circuits; design for manufacture; design rule definition; device variations; lithography margining; mask validation; process monitoring tools; process window; scribe-based circuits; transistor matching; via yield; Automatic testing; Circuit testing; Design for manufacture; Design methodology; Manufacturing industries; Manufacturing processes; Read only memory; Textile industry; Transistors; US Department of Energy; DFM; DOE ROM; novel test circuits; transistor array; transistor matching; via yield;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7695-2523-7
Type
conf
DOI
10.1109/ISQED.2006.107
Filename
1613146
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