• DocumentCode
    3501369
  • Title

    Process window and device variations evaluation using array-based characterization circuits

  • Author

    Tabery, C. ; Craig, M. ; Burbach, G. ; Wagner, B. ; McGowan, S. ; Etter, P. ; Roling, S. ; Haidinyak, C. ; Ehrichs, E.

  • Author_Institution
    Adv. Micro Devices, Sunnyvale, CA
  • fYear
    2006
  • fDate
    27-29 March 2006
  • Lastpage
    265
  • Abstract
    Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools
  • Keywords
    design for manufacture; integrated circuit design; process monitoring; proximity effect (lithography); OPC qualification; OPC refinement; array-based characterization circuits; design for manufacture; design rule definition; device variations; lithography margining; mask validation; process monitoring tools; process window; scribe-based circuits; transistor matching; via yield; Automatic testing; Circuit testing; Design for manufacture; Design methodology; Manufacturing industries; Manufacturing processes; Read only memory; Textile industry; Transistors; US Department of Energy; DFM; DOE ROM; novel test circuits; transistor array; transistor matching; via yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2006. ISQED '06. 7th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-2523-7
  • Type

    conf

  • DOI
    10.1109/ISQED.2006.107
  • Filename
    1613146